Hello Tech Netters,

Has anyone dealt with the following condition:

Bare boards are ENIG, several SMT pads within wide traces. After ENIG,
soldermask is peeling from copper on the traces, at the junction of the ENIG
and mask. We have eliminated any mask failure possibilities. What, if
anything in the ENIG process (or error in the process) would compromise the
soldermask adhesion and lift it from the copper?

Any help will be appreciated.

K Bergman

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------