I will suggest a conductive via fill in these areas to provide a flat
SMT site, because - solder joint could be starved by flow down into the
via.  Also Sm plugged on the opposite side will also cause excessive
voiding as the capped via will provide a good outgassing effect during
relow.  Not the cheapest solution but is effective in hiding vias in
pad.  



Jeffrey Bush
Director, Quality Assurance and Technical Support

                          76 Technology Drive - POB 1890
                             Brattleboro, Vermont 05302-1890
                                Tel. 802.257.4571.21 Fax. 802.257.0011
                                    [log in to unmask]
                              http://www.vtcircuits.com	



-----Original Message-----
From: Tom Parkinson [mailto:[log in to unmask]] 
Sent: Friday, June 25, 2004 11:14 AM
To: [log in to unmask]
Subject: [TN] VIA in Pad


We're a CM.  One of our customers is asking us to build a board assembly
that will be using BGAs with VIAs in pads.  They are in the design
stages at this point, and we have some concerns with having a Via in the
middle of a BGA pad.  Anyone have suggestions and/or experience with
this??

Thanks


Tom Parkinson - Quality System Manager - CIT
WinTronics, Inc.
Ph: 724-981-5770 Ext. 235
Fax: 724-981-1772
 

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