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December 2003

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Subject:
Re: SnPb Solder pot composition.
From:
"Dieselberg, Ron" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 3 Dec 2003 10:21:12 -0500
Content-Type:
text/plain
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text/plain (62 lines) 
Yordan, What was your nominal SnPb? IPC J-001 indicates the alloy shall be within +/- 1.5% of the solder specified. Since you are close to 63/37 you should be OK if your contamination limits are under control.
If you have a copy of J-001 see para. 5.3, 5.4 and table 5-1.
Hope this helps.

Ron Dieselberg
Trainer
CMC Electronics Cincinnati
[log in to unmask]


-----Original Message-----
From: Yordan Venev [mailto:[log in to unmask]]
Sent: Wednesday, December 03, 2003 7:58 AM
To: [log in to unmask]
Subject: [TN] SnPb Solder pot composition.


We have made a composition analysis of our solder wave solder pot and
discovered a deviation of the SnPB content. The Sn percentage had gone up to
65.45% and the Pb content down to 34.54%. I suppose there will be a (small)
change in the constitutional behaviour of the alloy - some bigger range of
the liquid-to-solid stage. Except this, what should we be aware of in
practice in regards to solder joint quality and reliability? We continue to
maintain the pot temperature at 250 deg C (482 deg F).

Any inputs will be appreciated!

Best regards,
Yordan Venev

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