We have made a composition analysis of our solder wave solder pot and
discovered a deviation of the SnPB content. The Sn percentage had gone up to
65.45% and the Pb content down to 34.54%. I suppose there will be a (small)
change in the constitutional behaviour of the alloy - some bigger range of
the liquid-to-solid stage. Except this, what should we be aware of in
practice in regards to solder joint quality and reliability? We continue to
maintain the pot temperature at 250 deg C (482 deg F).

Any inputs will be appreciated!

Best regards,
Yordan Venev

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