Yordan:
There are 11 metals on table 5.1 of the J-Std-001C page
five. You are missing Cadmium, Arsenic, Silver, Nickel and Bismuth.
Regards,
Ramon
> -----Original Message-----
> From: Yordan Venev [SMTP:[log in to unmask]]
> Sent: Thursday, December 04, 2003 2:58 AM
> To: [log in to unmask]
> Subject: Re: [TN] SnPb Solder pot composition.
>
> Ron, Louis, Dale, Edward, Hans, Ramon, Sasha, (hope didn't miss anyone)
>
> thank you all for the inputs! The analysis was done by means of a scanning
> electronic microscope JEOL JSM 35 CF with X-ray microanalyser TRACOR
> NORTHERN TN-200, and for samples are used JEOL standards. Parallel to
this
> we have order an analysis of new solder 63/37 (a kind of reliability
check)
> and it showed Sn - 62,37%/ Pb-37,62%. As far as the other materials (Cu,
Au,
> Sb, Fe, Al, Zn) are concerned it seems we have very low level of
> impurities - below 0.01%. Besides the missing Antimony in our analysis,
are
> there other impurities with crucial impact on the solder quality that must
> be checked? Sasha, unfortunately, the still surface of the pot while
taking
> sample is not the case - the sample was drown after the solder was mixed
> well and from the "crest of the wave".
>
> Yordan
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Edward Szpruch
> Sent: Wednesday, December 03, 2003 4:47 PM
> To: [log in to unmask]
> Subject: Re: [TN] SnPb Solder pot composition.
>
>
> Yordan,
> I do have experience with solder wave, only with HASL, but I presume the
> rules are the same:
> -usually the analyses is done to indicate more than 10 materials such as
> Copper, Gold, Antymony, Iron,Silver etc.Those have high influence on both
> metling point and solder joint quality.Limits on such material are really
on
> low level.
> - Concerning Pb - Sn : usually only one of them is analysed, the second
> stated by ballance to 100% .
> The results concerning Pb-Sn are OK, but what with other stuff???
> Edward
>
>
> > -----Original Message-----
> > From: Louis Hart [SMTP:[log in to unmask]]
> > Sent: ד דצמבר 03 2003 16:25
> > To: [log in to unmask]
> > Subject: Re: [TN] SnPb Solder pot composition.
> >
> > Yordan, I'll leave others to comment on solder joint quality and
> > reliability. How are the composition analyses done? I'd bet the
> > measurements are not truly good to 0.01%. I asked a big solder
> > manufacturer
> > for measurement quality data 2 or 3 years ago, and did not get a good
> > answer. Lou Hart
> >
> > -----Original Message-----
> > From: TechNet [mailto:[log in to unmask]]On Behalf Of Yordan Venev
> > Sent: Wednesday, December 03, 2003 7:58 AM
> > To: [log in to unmask]
> > Subject: [TN] SnPb Solder pot composition.
> >
> >
> > We have made a composition analysis of our solder wave solder pot and
> > discovered a deviation of the SnPB content. The Sn percentage had gone
up
> > to
> > 65.45% and the Pb content down to 34.54%. I suppose there will be a
> > (small)
> > change in the constitutional behaviour of the alloy - some bigger range
of
> > the liquid-to-solid stage. Except this, what should we be aware of in
> > practice in regards to solder joint quality and reliability? We continue
> > to
> > maintain the pot temperature at 250 deg C (482 deg F).
> >
> > Any inputs will be appreciated!
> >
> > Best regards,
> > Yordan Venev
> >
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