"We currently buy
>phones and other items that start failing after a year or
>less."
======
Phone could be a critical tool at time of crises, such as the 911 call
during last week's blackout for people trapped some places.  Are you
telling me there is no reliability assessment on the green leaf product?
Is the product pass the tests, such as thermal shock without dwell, the
like Warner mentioned in his e-mail?  That is really scary.  If the
product is pass all the tests but still fail in the field in such short
time, look like we better not count on it for the 911 call...(it better
don't have blackout today!).  Look like we would get more disposible
phone for the land fill... 1 year vs. 3 year minimum of regular
Pb/Sn.... Let's see what EU going to say about that....(no requirement
to take back the leadfree product...hahaha...may be we can send them
back to EU for land fill....hehehe).
                                                            jk

>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Dehoyos, Ramon
>Sent: Thursday, August 21, 2003 9:08 AM
>To: [log in to unmask]
>Subject: Re: [TN] Lead Free
>
>
>        Although the manufacturing of chips is a process where
>high temperatures are used. After the chips are built , the
>wafer is thinned out from 30 mils to 4 mils.  Material this
>thin does not take  stresses very well. Plus the packages may
>start leaking when they are exposed to higher temperatures
>than the ones that they are exposed to now. We currently buy
>phones and other items that start failing after a year or
>less. If technolgy improved to come up with a way to connect
>parts to boards which did not exposed components to higher
>temps, it would be a good idea to implement it. The cons are
>stacked against it. If a leader or group does not surface to
>fight this bad idea, we will be forced to go to lead free
>solder.  It will be a very expensive change.
>        My two cents.
>        Ramon
>
>>
>>
>> I've just received the August IPC Review.
>>
>> On p. 6, there is an article, "Lead Time on Lead Free
>Dwindles". This
>> re-states the deadline of 1 July 2006 for total lead-free soldering
>> for products sold in Europe (ignoring the few named exceptions).
>>
>>
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