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August 2003

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Subject:
From:
"Dehoyos, Ramon" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 21 Aug 2003 06:08:21 -0700
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        Although the manufacturing of chips is a process where high
temperatures are used. After the chips are built , the wafer is thinned out
from 30 mils to 4 mils.  Material this thin does not take  stresses very
well. Plus the packages may start leaking when they are exposed to higher
temperatures than the ones that they are exposed to now. We currently buy
phones and other items that start failing after a year or less. If technolgy
improved to come up with a way to connect parts to boards which did not
exposed components to higher temps, it would be a good idea to implement it.
The cons are stacked against it. If a leader or group does not surface to
fight this bad idea, we will be forced to go to lead free solder.  It will
be a very expensive change.
        My two cents.
        Ramon

>
>
> I've just received the August IPC Review.
>
> On p. 6, there is an article, "Lead Time on Lead Free Dwindles". This
> re-states the deadline of 1 July 2006 for total lead-free soldering for
> products sold in Europe (ignoring the few named exceptions).
>
>
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