It sounds like the solder paste is melting before the glue cures, I'd
recommend comparing the glue-cure temperature vs the paste eutectic
temperature vs your reflow profile. Testing each one separately only tells
you that they individually perform per their specs. Compare the specs.
>From: Bill Page <[log in to unmask]>
>Reply-To: "TechNet E-Mail Forum." <[log in to unmask]>, Bill Page
><[log in to unmask]>
>To: [log in to unmask]
>Subject: [TN] This is a new one on me
>Date: Wed, 22 Jan 2003 09:09:09 -0600
>
>Hey folks,
>
>I've been in this business for over 20 years, and thought I had seen it
>all,
>but this is a new one. We're having problems with our glue/wave solder
>process. Parts are falling off the board.
>
>"That's not new," you say?
>"Check your handling, stupid," you say?
>"Check your glue cure process, stupid," you say?
>
>Yep.
>Shear tests indicate that our glue process is working.
>We're using a product that is very widely used in the industry, following
>the manufacturer's recommended cure profile.
>
>And yet, parts fall off -- as they go through the wave solder machine.
>Adhesive stays put. Has a flat surface where the part used to be.
>Pads are beautifully soldered...just no parts there.
>And we have verified that the parts are present before the wave.
>
>Across chip suppliers and part numbers, across solder mask types, across
>PWB
>vendors.
>
>Is it just me?
>Is the business finally catching up with me?
>Should I give up and become a high school band director?
>
>Your suggestions are welcome!
>
>Bill Page
>Kenosha, WI
>
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