We have an overseas board supplier that is supplying an immersion gold
finished board that is only 1-1.5 microinches of gold over 100 microinches
of nickel.  I believe this may be too thin a gold layer for adequate
protection of the nickel but don't have any objective evidence for this.
Can anybody give me any feedback or other information sources that might
support this?  IPC-2221 specifies approximately 3-9 microinches of gold
which is what we generally require, but I'm looking for additional objective
evidence for requiring thicker gold deposits.

Thanks in advance.

Rick Thompson

Sr. SMT Process Engineer
SMTEK International, Inc.
+1 (805) 532-2800
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