We have an overseas board supplier that is supplying an immersion gold finished board that is only 1-1.5 microinches of gold over 100 microinches of nickel. I believe this may be too thin a gold layer for adequate protection of the nickel but don't have any objective evidence for this. Can anybody give me any feedback or other information sources that might support this? IPC-2221 specifies approximately 3-9 microinches of gold which is what we generally require, but I'm looking for additional objective evidence for requiring thicker gold deposits. Thanks in advance. Rick Thompson Sr. SMT Process Engineer SMTEK International, Inc. +1 (805) 532-2800 [log in to unmask] --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------