Fellow TechNetters,
I have several question regarding plating processes.
1). What is the reasoning for plating gold/nickel/Copper (base
material).?
2). What is the reasoning for not placing Tin Lead, HASL, over
plated gold.?
3). What is the reasoning for plating Tin Lead/nickel/copper ( base
material ).?
Is there a quick reference publication that easily warns a user of the
Pros and Cons of plated processes.?
I am not a metallurgist by trade.
Victor G. Hernandez
Component/Material Failure Analysis Eng.
PS4-1, Rm. 132
Ofc: 512-725-3471
Pgr: 512-907-0005
---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------