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July 2002

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From:
Victor Hernandez <[log in to unmask]>
Date:
Thu, 18 Jul 2002 12:54:45 -0500
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"TechNet E-Mail Forum." <[log in to unmask]>, [log in to unmask]
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Fellow TechNetters,

   I have several question regarding plating processes.

        1).  What is the reasoning for plating gold/nickel/Copper (base
material).?
        2).  What is the reasoning for not placing Tin Lead, HASL, over
plated gold.?
        3).  What is the reasoning for plating Tin Lead/nickel/copper ( base
material ).?

   Is there a quick reference publication that easily warns a user of the
Pros and Cons of plated processes.?
   I am not a metallurgist by trade.

Victor G. Hernandez
Component/Material Failure Analysis Eng.
PS4-1, Rm. 132
Ofc:     512-725-3471
Pgr:     512-907-0005

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