Fellow TechNetters, I have several question regarding plating processes. 1). What is the reasoning for plating gold/nickel/Copper (base material).? 2). What is the reasoning for not placing Tin Lead, HASL, over plated gold.? 3). What is the reasoning for plating Tin Lead/nickel/copper ( base material ).? Is there a quick reference publication that easily warns a user of the Pros and Cons of plated processes.? I am not a metallurgist by trade. Victor G. Hernandez Component/Material Failure Analysis Eng. PS4-1, Rm. 132 Ofc: 512-725-3471 Pgr: 512-907-0005 --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------