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Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 15 May 2002 09:09:20 -0600 |
Content-Type: | text/plain |
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Steve,
I saw data presented by Dr. Wayne Johnson, Auburn Univ. last month, that
showed dramatic improvement in Mechanical Shock survivability on ball grid
devices. I don't recall the test method or pitch... could be CSP or BGA or
both.
Bruce Misner
> ----------
> From: [log in to unmask][SMTP:[log in to unmask]]
> Reply To: TechNet E-Mail Forum.;[log in to unmask]
> Sent: Tuesday, May 14, 2002 5:08 PM
> To: [log in to unmask]
> Subject: [TN] BGA's on ruggedized assemblies...
>
> Hi All!
>
> Gotta question, when BGA's are used on ruggedized assemblies (at least
> Level-4, probably Level-5), is underfilling BGA's recommended, or a
> necessity?
>
> Thanks, as always...
>
> -Steve Gregory-
>
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