Steve, I saw data presented by Dr. Wayne Johnson, Auburn Univ. last month, that showed dramatic improvement in Mechanical Shock survivability on ball grid devices. I don't recall the test method or pitch... could be CSP or BGA or both. Bruce Misner > ---------- > From: [log in to unmask][SMTP:[log in to unmask]] > Reply To: TechNet E-Mail Forum.;[log in to unmask] > Sent: Tuesday, May 14, 2002 5:08 PM > To: [log in to unmask] > Subject: [TN] BGA's on ruggedized assemblies... > > Hi All! > > Gotta question, when BGA's are used on ruggedized assemblies (at least > Level-4, probably Level-5), is underfilling BGA's recommended, or a > necessity? > > Thanks, as always... > > -Steve Gregory- > --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------