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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 31 Jan 2002 19:28:04 -0500 |
Content-Type: | text/plain |
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We have been having a problem with Dupont silver CB100 VIA Plug. The
boards are 12 layer, .062", FR4, Nickel/Gold plated.
We have a BGA pattern with VIA in hole. The VIAs are filled with CB100 VIA
plug and then the board is plated.
The VIAs are .010 causing an aspect ratio of 6.2:1. We are seeing after
solder reflow, inner layer delamination in the area of the
VIA filled BGA patterns. Has anyone seen this before? Does anyone use a
similar construction and had success? There are a few
theories flying around but I wanted to ask the IPC community for any
insight. Thank you in advance.
Best Regards,
Mike Forrester
Sr. Manufacturing Engineer
[log in to unmask]
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