We have been having a problem with Dupont silver CB100 VIA Plug. The boards are 12 layer, .062", FR4, Nickel/Gold plated. We have a BGA pattern with VIA in hole. The VIAs are filled with CB100 VIA plug and then the board is plated. The VIAs are .010 causing an aspect ratio of 6.2:1. We are seeing after solder reflow, inner layer delamination in the area of the VIA filled BGA patterns. Has anyone seen this before? Does anyone use a similar construction and had success? There are a few theories flying around but I wanted to ask the IPC community for any insight. Thank you in advance. Best Regards, Mike Forrester Sr. Manufacturing Engineer [log in to unmask] --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------