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Mon, 5 Nov 2001 09:24:24 -0500 |
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Hello,
I am hoping someone here can help with the following: recent inquiries
have come up with respect to the effect of BGA rework to surrounding
components. Can the heat effect to surrounding components -- the
possibility (and probability) that they will reach reflow temperatures,
cause problems? I am thinking of cases where some BGA balls might reach
reflow temperatures and others might not on a single package at
proximity to the reworked site. Another case would be where BGA
packages at proximity to the reworked BGA are simply reaching high
temperatures - for possibly many heat/rework cycles..
Impact to solder joint metallurgy
Impact to solder joint reliability
Any help or reference would be greatly appreciated.
--
Jason Cross
Physical Technology Engineer
Alcatel Canada, Inc.
(613) 784-4793
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