Hello, I am hoping someone here can help with the following: recent inquiries have come up with respect to the effect of BGA rework to surrounding components. Can the heat effect to surrounding components -- the possibility (and probability) that they will reach reflow temperatures, cause problems? I am thinking of cases where some BGA balls might reach reflow temperatures and others might not on a single package at proximity to the reworked site. Another case would be where BGA packages at proximity to the reworked BGA are simply reaching high temperatures - for possibly many heat/rework cycles.. Impact to solder joint metallurgy Impact to solder joint reliability Any help or reference would be greatly appreciated. -- Jason Cross Physical Technology Engineer Alcatel Canada, Inc. (613) 784-4793 --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------