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Craig,
The SMART Group ran a small survey on this recently -
http:www.smartgroup.org, click on surveys on the left menu bar, I think
it was Jan this year. It wasn't CEM-specific, nor very detailed. Maybe
future surveys will elaborate.
Regards,
Peter
--
=========================================================
Peter Swanson [log in to unmask]
INTERTRONICS http://www.intertronics.co.uk
INTERTRONICS is dedicated to providing quality material,
consumable and equipment solutions to the electronics
manufacturing and other technology based industries, with
the highest levels of technical support and customer
service.
-----Original Message-----
From: Craig Hillman [mailto:[log in to unmask]]
Sent: 27 June 2001 15:28
To: [log in to unmask]
Subject: [TN] How do you reflow?
Werner brings up an interesting point. Does anyone have an opinion on
the
trends in solder reflow in the contract assembly industry? Are we seeing
a
resurgence in vapor phase? Has flowing nitrogen during infrared fallen
to
the wayside? Interested in seeing your responses.
Best Regards,
Craig
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Werner Engelmaier
Sent: Thursday, May 31, 2001 1:19 PM
To: [log in to unmask]
Subject: Re: [TN] AW: [TN] Pad in Via for BGA's - Part II
Hi Rush,
Vapor phase soldering was and is thew most elegant engineering solution
to
soldering--no over-temperatures, no profiles, absolute temperature
uniformity. What killed this approach in the past was inadequate
equipment--thhis is no loger a problem.
Werner Engelmaier
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