Craig, The SMART Group ran a small survey on this recently - http:www.smartgroup.org, click on surveys on the left menu bar, I think it was Jan this year. It wasn't CEM-specific, nor very detailed. Maybe future surveys will elaborate. Regards, Peter -- ========================================================= Peter Swanson [log in to unmask] INTERTRONICS http://www.intertronics.co.uk INTERTRONICS is dedicated to providing quality material, consumable and equipment solutions to the electronics manufacturing and other technology based industries, with the highest levels of technical support and customer service. -----Original Message----- From: Craig Hillman [mailto:[log in to unmask]] Sent: 27 June 2001 15:28 To: [log in to unmask] Subject: [TN] How do you reflow? Werner brings up an interesting point. Does anyone have an opinion on the trends in solder reflow in the contract assembly industry? Are we seeing a resurgence in vapor phase? Has flowing nitrogen during infrared fallen to the wayside? Interested in seeing your responses. Best Regards, Craig -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Werner Engelmaier Sent: Thursday, May 31, 2001 1:19 PM To: [log in to unmask] Subject: Re: [TN] AW: [TN] Pad in Via for BGA's - Part II Hi Rush, Vapor phase soldering was and is thew most elegant engineering solution to soldering--no over-temperatures, no profiles, absolute temperature uniformity. What killed this approach in the past was inadequate equipment--thhis is no loger a problem. Werner Engelmaier ------------------------------------------------------------------------ ---- ----- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ------------------------------------------------------------------------ ---- ----- ------------------------------------------------------------------------ --------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ------------------------------------------------------------------------ --------- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------