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Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 27 Oct 2000 11:53:08 EDT |
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In a message dated 10/27/2000 9:06:15 AM US Eastern Standard Time,
[log in to unmask] writes:
> Before I would recommend looking for contamination, I would do some
> solderability testing of the components. Component lead solderability
testing is pretty
> straight forward and can imploy accelerated aging through steam prior to
> testing. Then if there was a problem, and depending on what the de-wet
or non-wet areas
> looked like would I continue with contamination testing.
I agree with Susan. While a residue could be the cause of poor
solderability, it is more often a case of oxidation, which contamination
testing won't address. Sequential Electrochemical Reduction Analysis (SERA),
in the hands of a good operator, can tell you a great deal about the oxide
picture present.
Doug Pauls
CSL
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