In a message dated 10/27/2000 9:06:15 AM US Eastern Standard Time, [log in to unmask] writes: > Before I would recommend looking for contamination, I would do some > solderability testing of the components. Component lead solderability testing is pretty > straight forward and can imploy accelerated aging through steam prior to > testing. Then if there was a problem, and depending on what the de-wet or non-wet areas > looked like would I continue with contamination testing. I agree with Susan. While a residue could be the cause of poor solderability, it is more often a case of oxidation, which contamination testing won't address. Sequential Electrochemical Reduction Analysis (SERA), in the hands of a good operator, can tell you a great deal about the oxide picture present. Doug Pauls CSL --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------