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Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 4 Apr 2000 11:12:01 -0500 |
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>>> Le Dai Tri <[log in to unmask]> 04/04/00 12:54AM >>>
TechNetters,
I 'd like to confirm about "Section 2.6-ENVIRONMENTAL TEST METHODS" of
IPC TM-650 Test Methods Manual"
2.6.6B Temperature Cycling, Printed Wiring Board--12/87
2.6.7A Thermal Shock and Continuity, Printed Board--8/97
2.6.7.2A Thermal Shock, Continuity and Microsection, Printed Board--8/97
2.6.8D Thermal Stress, Plated Through-Holes--3/98
Are these methods latest versions?
If it is old version, Could you send me new one?
Any input would be greatly appreciated.
Best regards,
TRI
E-Mail: [log in to unmask]
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