>>> Le Dai Tri <[log in to unmask]> 04/04/00 12:54AM >>> TechNetters, I 'd like to confirm about "Section 2.6-ENVIRONMENTAL TEST METHODS" of IPC TM-650 Test Methods Manual" 2.6.6B Temperature Cycling, Printed Wiring Board--12/87 2.6.7A Thermal Shock and Continuity, Printed Board--8/97 2.6.7.2A Thermal Shock, Continuity and Microsection, Printed Board--8/97 2.6.8D Thermal Stress, Plated Through-Holes--3/98 Are these methods latest versions? If it is old version, Could you send me new one? Any input would be greatly appreciated. Best regards, TRI E-Mail: [log in to unmask] ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################