>>> Le Dai Tri <[log in to unmask]> 04/04/00 12:54AM >>>
TechNetters,

I 'd like to confirm about "Section 2.6-ENVIRONMENTAL TEST METHODS"  of
IPC TM-650 Test Methods Manual" 
  2.6.6B Temperature Cycling, Printed Wiring Board--12/87 
  2.6.7A Thermal Shock and Continuity, Printed Board--8/97 
  2.6.7.2A Thermal Shock, Continuity and Microsection, Printed Board--8/97 
  2.6.8D Thermal Stress, Plated Through-Holes--3/98
Are these methods latest versions?
If it is old version, Could you send me new one?

Any input would be greatly appreciated.

Best regards,
TRI                                                                                       
E-Mail: [log in to unmask] 

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