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November 2010

TGAsia@IPC.ORG
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multipart/alternative; boundary="0-1064389861-1289826504=:23622"
Sender:
TGAsia <[log in to unmask]>
Subject:
IPC standards enquiry on solder pads lifting specs
From:
Patricia Lui <[log in to unmask]>
Date:
Mon, 15 Nov 2010 21:08:24 +0800
MIME-Version:
1.0
X-To:
IPC Task group mass <[log in to unmask]>
Reply-To:
Asia Committe Task Group Forum <[log in to unmask]>, Patricia Lui <[log in to unmask]>
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