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Date: | Sat, 8 Dec 2012 00:33:45 +0000 |
Content-Type: | multipart/related |
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Hi,chenhao:
PCB在Reflow過程中,或維修更換IC芯片時出現PCB下陷 是指啥狀況?可否再具體說明下,另外再個別放大圖片,如你所說下下陷的issue圖片,謝謝!
Best Regards
寄件者: TGAsia [mailto:[log in to unmask]] 代理 Chen Hao
寄件日期: 2012年12月7日 11:03
收件者: [log in to unmask]
主旨: [TGAsia] PCB焊接時出現下陷不良現象
Hi All,
大家好!近日實驗室在進行失效分析過程中遇到以下案例,請教發生的原因為何,該如何進行改進?
1. 不良現象描述:PCB在Reflow過程中,或維修更換IC芯片時出現PCB下陷,如下為切片分析數據:
[cid:[log in to unmask]]
2. 目前該產品有兩款PCB在使用,其中一款未發生類似狀況,一款有發生,所以對其疊構進行分析差異如下:
叠构
問題板 单位 MIL
正常板 单位 MIL
差异
Layer 1铜
0.7
0.602
Layer 1 铜厚不同
PP
6.68
6
問題板1506 pp 1张,含胶量48%;
正常板1080 PP 2张,含胶量63%;
Layer 2铜
1.4
1.4
/
PP
46.8
47.24
基板PP厚度不同;但是TG均≧135℃
Layer 3铜
1.4
1.4
/
PP
6.68
6
問題板1506 pp 1张,含胶量48%;
正常板1080 PP 2张,含胶量63%;
Layer 4铜
0.7
0.602
/
[cid:[log in to unmask]]
[cid:[log in to unmask]]
BR,
Michael
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