JIS Z 3198-7 Test methods for lead-free solders --
Part 7: Method for shear strength of solder joints
on chip components

IEC/JEITA Standard
(Provisional title) Method for testing the side push
shear strength of soldered connections of surface mounted devices
using lead-free
solder

Similar Standards
SEMI G63-95 Test Method for Measurement of Die Shear Strength
JEITA ET-7403 Test methods of mechanical strength of surface mounting devices
JIS C0051 Environmental test methods - electrical, electronic - method
of testing terminal
strength

在 2011年11月1日 下午4:00，Jim Wang <[log in to unmask]> 写道：
> All
>
>
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> 针对SMT小的Chip元件，在锡膏制程回流焊接后，是否在推力标准？
>
>
>
> Best Regards,
>
>
>
> Jim.Wang | QA Officer | Season Components Co., Ltd.
>
>
>
> Email address: [log in to unmask]
>
> Website address: http://www.seasongroup.com
>
> Tel:  (86) 769-8338-8030  Ext. 8018 or 13652594880
>
> Fax: (86) 769-8338-7427
>
> ______________________________________________________________________
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-- 
Best Regareds!
SHI Hongbin (史 洪賓)

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TEL: 0081-080-3943-6281
Skype: hungpinshin
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