JIS Z 3198-7 Test methods for lead-free solders -- Part 7: Method for shear strength of solder joints on chip components IEC/JEITA Standard (Provisional title) Method for testing the side push shear strength of soldered connections of surface mounted devices using lead-free solder Similar Standards SEMI G63-95 Test Method for Measurement of Die Shear Strength JEITA ET-7403 Test methods of mechanical strength of surface mounting devices JIS C0051 Environmental test methods - electrical, electronic - method of testing terminal strength 在 2011年11月1日 下午4:00,Jim Wang <[log in to unmask]> 写道: > All > > > > 针对SMT小的Chip元件,在锡膏制程回流焊接后,是否在推力标准? > > > > Best Regards, > > > > Jim.Wang | QA Officer | Season Components Co., Ltd. > > > > Email address: [log in to unmask] > > Website address: http://www.seasongroup.com > > Tel: (86) 769-8338-8030 Ext. 8018 or 13652594880 > > Fax: (86) 769-8338-7427 > > ______________________________________________________________________ > This email has been scanned by the MessageLabs Email Security System. > For more information please contact helpdesk at x2960 or [log in to unmask] > ______________________________________________________________________ > -- Best Regareds! SHI Hongbin (史 洪賓) ------+------+------+------+------+------+------+------+------+------+------+------+------+------+------+------ TEL: 0081-080-3943-6281 Skype: hungpinshin QQ: 59070371 ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________