TGASIA Archives

April 2009

TGAsia@IPC.ORG
Options: Use Monospaced Font
Show HTML Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Re: 焊接反润湿
From:
peter gong <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, peter gong <[log in to unmask]>
Date:
Thu, 30 Apr 2009 19:54:07 +0800
Content-Type:
multipart/alternative
Parts/Attachments:
text/plain (863 bytes) , text/html (1428 bytes) 
Hello Toby，

From the picture you provided，there are really some problems in your process
as de-wetting！

What I suggest is to  check the solderability of PCB land and  the lead of
component. Of course the solder paste and reflow profile is also suspected
which is basic job to do!


Best Regards

龔岳曦
*Peter Gong*
cellular phone:China 13417366601
MSN: [log in to unmask] <mailto:[log in to unmask]>_
_ [log in to unmask] <mailto:[log in to unmask]>



2009/4/29 HouToby <[log in to unmask]>

> Hi All:
> 请教焊接的反润湿是什么原因造成的?图片中的是吗?
>
> ------------------------------
> 立刻下载 MSN 保护盾，保障Messenger 安全稳定！ 现在就下载！ <http://im.live.cn/safe/>
>

ATOM RSS1 RSS2