Hello Toby，

From the picture you provided，there are really some problems in your process
as de-wetting！

What I suggest is to  check the solderability of PCB land and  the lead of
component. Of course the solder paste and reflow profile is also suspected
which is basic job to do!


Best Regards

龔岳曦
*Peter Gong*
cellular phone:China 13417366601
MSN: [log in to unmask] <mailto:[log in to unmask]>_
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2009/4/29 HouToby <[log in to unmask]>

> Hi All:
> 请教焊接的反润湿是什么原因造成的?图片中的是吗?
>
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