TGASIA Archives

December 2013

TGAsia@IPC.ORG
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Subject:
請教各位有沒有遇到類似的器件
From:
Tang Xianjun <[log in to unmask]>
Reply To:
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Date:
Thu, 12 Dec 2013 00:31:23 +0000
Content-Type:
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Hi,ALL:
        試產中遇到中間塑膠本體底部比兩端PAD高，造成零件焊接空焊，器件為SW，塑膠底部與兩端PAD spec定義高度為0.06mm,公差為±0.30mm,請問各位遇到過這樣的器件嗎，是需要怎樣處理才會使器件焊接OK，感謝！



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