Hi,ALL:
        試產中遇到中間塑膠本體底部比兩端PAD高，造成零件焊接空焊，器件為SW，塑膠底部與兩端PAD spec定義高度為0.06mm,公差為±0.30mm,請問各位遇到過這樣的器件嗎，是需要怎樣處理才會使器件焊接OK，感謝！



[cid:[log in to unmask]]

[cid:[log in to unmask]]


______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________