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December 2013

TGAsia@IPC.ORG
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Subject:
IC 焊接问题
From:
Chen Hao <[log in to unmask]>
Reply To:
[log in to unmask]
Date:
Wed, 25 Dec 2013 06:12:41 +0000
Content-Type:
multipart/mixed
Parts/Attachments:
text/plain (134 kB) , text/html (5 kB) , image001.png (134 kB) , IC.JPG (32 kB) 
Hi All

请问同行这样封装的IC，Reflow条件及生产过程中是否有特别需要注意的点？
另外，这种封装的IC四个角落是否特别容易出现Crack现象？该如何避免及预防？

以上，谢谢！
[cid:[log in to unmask]]



BR,
Michael


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