Hi All 请问同行这样封装的IC,Reflow条件及生产过程中是否有特别需要注意的点? 另外,这种封装的IC四个角落是否特别容易出现Crack现象?该如何避免及预防? 以上,谢谢! [cid:[log in to unmask]] BR, Michael ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________