不知各位先進是否可以點出此問題點是在IPC-610E的哪章節判定標準? 因敝司品保要釐清責任歸屬。
感謝!
2012/6/8 "Yun, Xunisa (惲黎銀 IES)" <[log in to unmask]>
> 铜箔被溶解,需检查WS制程之Dwell time是否超时,原则上此类板卡不可出货。****
>
> ** **
>
> ** **
>
> *发件人:* TGAsia [mailto:[log in to unmask]] *代表 *Hsun-Yi Tseng
> *发送时间:* 2012年6月8日 11:18
> *收件人:* [log in to unmask]
> *主题:* [TGAsia] 請問附件3種焊接不良現象的IPC判定標準****
>
> ** **
>
> 如題求教,謝謝!!****
>
> ** **
>
>
> ______________________________________________________________________
> This email has been scanned by the Symantec Email Security.cloud service.
> For more information please contact helpdesk at x2960 or [log in to unmask]
> ______________________________________________________________________****
>
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________