TGASIA Archives

June 2012

TGAsia@IPC.ORG

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Subject:
From:
Hsun-Yi Tseng <[log in to unmask]>
Reply To:
Hsun-Yi Tseng <[log in to unmask]>
Date:
Fri, 8 Jun 2012 22:12:39 +0800
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不知各位先進是否可以點出此問題點是在IPC-610E的哪章節判定標準? 因敝司品保要釐清責任歸屬。
感謝!


2012/6/8 "Yun, Xunisa (惲黎銀 IES)" <[log in to unmask]>

> 铜箔被溶解,需检查WS制程之Dwell  time是否超时,原则上此类板卡不可出货。****
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> *发件人:* TGAsia [mailto:[log in to unmask]] *代表 *Hsun-Yi Tseng
> *发送时间:* 2012年6月8日 11:18
> *收件人:* [log in to unmask]
> *主题:* [TGAsia] 請問附件3種焊接不良現象的IPC判定標準****
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> 如題求教,謝謝!!****
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