铜箔被溶解，需检查WS制程之Dwell time是否超时，原则上此类板卡不可出货。
发件人: TGAsia [mailto:[log in to unmask]] 代表 Hsun-Yi Tseng
发送时间: 2012年6月8日 11:18
收件人: [log in to unmask]
主题: [TGAsia] 請問附件3種焊接不良現象的IPC判定標準
如題求教，謝謝!!
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