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Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 24 Nov 1998 10:11:32 PST |
Content-Type: | text/plain |
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Hello,
I am reviewing any system designed for cross sectioning vias less
than 8 mils in diameter. We have all of the current systems (I
believe) including autogrind/alignment for mounting and are somewhat
successful, but it is very time consuming.
I'm looking for a system that will grind down to the center of the
via +/- .001". Possibly an optical alignment for grinding and
locating of the via. At the same time we will be upgrading our
microscope capability to view 500x on our video system. I would like
to review a tooling system for a new microscope that would be
compatable with the alignment system.
If you know of a system or sell one please contact me.
Thank you,
Joe Dickson
Dir. of Engineering
Tyco Printed Circuits Group
400 Mathew St.
Santa Clara, Ca. 95050
408-727-9169
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