Hello, I am reviewing any system designed for cross sectioning vias less than 8 mils in diameter. We have all of the current systems (I believe) including autogrind/alignment for mounting and are somewhat successful, but it is very time consuming. I'm looking for a system that will grind down to the center of the via +/- .001". Possibly an optical alignment for grinding and locating of the via. At the same time we will be upgrading our microscope capability to view 500x on our video system. I would like to review a tooling system for a new microscope that would be compatable with the alignment system. If you know of a system or sell one please contact me. Thank you, Joe Dickson Dir. of Engineering Tyco Printed Circuits Group 400 Mathew St. Santa Clara, Ca. 95050 408-727-9169 [log in to unmask] ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################