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September 2002

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Subject:
From:
Rudy Sedlak <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 25 Sep 2002 22:59:47 EDT
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Dan:

There are really three possibilities for you to consider for Tinning
Brass...None are easy and fun.

Perhaps the simplest idea is to use a molten Tin metal dip...which will leave
you thick, long lived, uneven deposits...

The next is immersion Tin plating...There are a lot of good systems out there
right now, as it is a common final finish on PCB pads..  Use one that needs
to be applied hot... this implies that there is a lot of chloride in the
system, and this means a good thick deposit...at least 3X (30+ microinches,
or .75 micron) what you have been getting with the system you described.

And, of course, there is always electroplating.. which usually requires a
pretty elaborate set up, with a couple of pre-clean steps, but which may be
the best/easiest for very thick deposits.

If you want to look at good immersion Tin systems, contact me directly, off
Technet, I may know how to get you a very good one.....:-)

Rudy Sedlak
RD Chemical Company

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