Dear Forum;
During BGA assembly rework attempt on a Class 2 assembly, one of the pads lifted. This pad has no connection. It is not used.
I was looking for IPC guidance and found guidelines for PCB repair of traces, but so far found no reference for repair of a BGA pad.
Are there guidelines for BGA repair and are there kits available to replace a lifted pad?
What risk(s) would exist if the BGA were placed without that pad in place under the ball?.
Regards,
Mark Julstrom
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