Dear Forum;
 
During BGA assembly rework attempt on a Class 2 assembly, one of the pads lifted.  This pad has no connection.  It is not used.
I was looking for IPC guidance and found guidelines for PCB repair of traces, but so far found no reference for repair of a BGA pad.
 
Are there guidelines for BGA repair and are there kits available to replace a lifted pad?
 
What risk(s) would exist if the BGA were placed without that pad in place under the ball?.
 
Regards,
 
Mark Julstrom

______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________