Dear Forum; During BGA assembly rework attempt on a Class 2 assembly, one of the pads lifted. This pad has no connection. It is not used. I was looking for IPC guidance and found guidelines for PCB repair of traces, but so far found no reference for repair of a BGA pad. Are there guidelines for BGA repair and are there kits available to replace a lifted pad? What risk(s) would exist if the BGA were placed without that pad in place under the ball?. Regards, Mark Julstrom ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________