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Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 17 Mar 2000 14:54:26 EST |
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Hi Rick,
Determining and maintaining reflow oven profiles for each assembly is a good
idea regardless of the the reflow method used (excepting vapor phase, of
course). While the heat transfer has improved with the 'Convection' ovens vs.
the 'IR' ovens, the size and thermal masses of components have gotten more
varied.
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com
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