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March 2000

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Date:
Fri, 17 Mar 2000 10:21:39 -0800
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Hello Rick,

My experience(little that there is) is that this is
achieveable, providing that your paste has a large
process window. Paste technology has evolved to more
of a "bell curve" type of profile plot. In the past,
soak time and temp was much more critical. Now, you
can get away with more. Hope I've helped.

jg

--- Rick Thompson <[log in to unmask]>
wrote:
> I've inherited a system of maintaining oven profiles
> where each assembly was
> given it's own profile.  While this may have been
> more appropriate with IR,
> I don't think that current convection ovens require
> this many.  I'm
> intending to try and reduce our profiles to 6 or so
> that can cover the range
> of products we run.   Is this a practical approach?
> I believe it is, but
> would appreciate any comments.  I'd also like to get
> feedback on systems
> that are currently being used.  How are you
> categorizing your profiles
> (mass, board size, etc.)?
>
> Thanks.
>
>
> Rick Thompson
> Ventura Electronics Assembly
> 2665A Park Center Dr.
> Simi Valley, CA 93065
>
> +1 (805) 584-9858 voice
> +1 (805) 584-1529 fax
> [log in to unmask]
>
>
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