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01:42 1996 |
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Thu, 21 Mar 96 20:01:00 EST |
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We have a standard 44 pin E-prom with "J" leads on a board that is
placed in a test fixture using gold pins and nylon standoffs for pressure
points. Because of the component layout, the pressure points (nylon
standoffs) on top are not directly in line with the clusters of test pins on
the bottom. Occasionally, some of the "J" lead connections of one
particular E-prom will shear off the board taking with it the majority of
the solder that was on the pad. The remaining pad has a thin coating of
solder with a grain like texture.
What are the guide lines for determining if the problem is poor shear
strength of the solder at the pad surface or just plain mechanical abuse by
the test fixture?
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