We have a standard 44 pin E-prom with "J" leads on a board that is placed in a test fixture using gold pins and nylon standoffs for pressure points. Because of the component layout, the pressure points (nylon standoffs) on top are not directly in line with the clusters of test pins on the bottom. Occasionally, some of the "J" lead connections of one particular E-prom will shear off the board taking with it the majority of the solder that was on the pad. The remaining pad has a thin coating of solder with a grain like texture. What are the guide lines for determining if the problem is poor shear strength of the solder at the pad surface or just plain mechanical abuse by the test fixture?