LISTSERV - TECHNET Archives - LISTSERV.IPC.ORG

TECHNET Archives

May 2002

TechNet@IPC.ORG

	LISTSERV Archives
	TECHNET Home
	TECHNET May 2002

	Log In
	Register

	Subscribe or Unsubscribe

	Search Archives

Options:	Use Monospaced Font Show Text Part by Default Condense Mail Headers
Message:	[<< First] [< Prev] [Next >] [Last >>]
Topic:	[<< First] [< Prev] [Next >] [Last >>]
Author:	[<< First] [< Prev] [Next >] [Last >>]

Sender:	TechNet <[log in to unmask]>
Subject:	Re: BGA Solderability
From:	Earl Moon <[log in to unmask]>
Date:	Thu, 23 May 2002 14:21:44 -0500
X-To:	Ryan Grant <[log in to unmask]>
Reply-To:	"TechNet E-Mail Forum." <[log in to unmask]>, Earl Moon <[log in to unmask]>
Parts/Attachments:	text/plain (20 lines)

Ryan,

I'm with you but sounds like presumption is defective, don't you think. See
my posting to Terri above. There is no need, in my objective opinion, to use
solder mask defined pads but to hold down poorly bonded pads on whatever
substrate material.

Earl

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2

LISTSERV.IPC.ORG