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FYI
______________________________ Forward Header __________________________________
Subject: Laminates and Prepregs
Author: JOHN GULLEY at HICAM-HDQ-OK
Date: 11/20/95 10:11 AM
Address,
Can anyone supply technical laymen information on Speed Ball and
Polyimide Laminates. I would also appreciate any test data (e.g.
thermal, humidity, solder, tensile strength tests) that have been
performed to prove the long reliability of these materials. A
material characteristics sheet is also helpful. Thank you.
John Gulley - PCB Project Coordinator
Hitachi Computer Products Division
1800 East Imhoff Rd
Norman, OK 73071
[log in to unmask]
405-360-5500 x634
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