FYI ______________________________ Forward Header __________________________________ Subject: Laminates and Prepregs Author: JOHN GULLEY at HICAM-HDQ-OK Date: 11/20/95 10:11 AM Address, Can anyone supply technical laymen information on Speed Ball and Polyimide Laminates. I would also appreciate any test data (e.g. thermal, humidity, solder, tensile strength tests) that have been performed to prove the long reliability of these materials. A material characteristics sheet is also helpful. Thank you. John Gulley - PCB Project Coordinator Hitachi Computer Products Division 1800 East Imhoff Rd Norman, OK 73071 [log in to unmask] 405-360-5500 x634